Power-Management ICs | IT Corporate

VIBRATION-INDUCED TWO-PHASE COOLING TECHNOLOGIES FOR HIGH POWER THERMAL MANAGEMENT

The present paper describes the operation of a small-scale VIDA heat transfer cell for cooling desktop microprocessors with particular emphasis on its...

Engineer’s Guide to 5G Semiconductor Test

This Whitpaper paper focuses on the new challenges of testing semiconductor devices for wideband 5G applications.The enhanced mobile...

Key Considerations for Powertrain HIL Test

Safety, availability, and cost considerations can make performing thorough tests of embedded control devices using the complete system impractical. ...

Communication Module Requirements for IoT Applications

With the rapid spread of the IoT, many devices that were not connected to a network in the past increasingly require the integration of a communication...

How to Improve DC/DC Converter Performance with Phase Shifting Time Delay

This article examines how to synchronize multiple DC/DC buck regulators in a Master/Slave configuration using phase shift time delay. Phase shifting multiple...

The Energy Harvesting Tipping Point for Wireless Sensor Applications

Ever since the first watermills and windmills were used to generate electricity, energy harvesting has been an attractive source of energy with great potential....

Leakage Currents in the Right Perspective

Trade-off between best attenuation effectiveness and minimum leakage current. Network filters (EMC filters) are often regarded as a Blackbox and,...

Published: Aug 26, 2022

Modular embedded technologies for cognitive RF and EW systems

Whether it is something as trivial as a business traveler trying to find Wi-Fi at an airport without falling victim to a spoof network, or something as...

USING LOW COST, NON-VOLATILE PLDS IN SYSTEM APPLICATIONS

System designers are faced with continual pressure to meet their development schedules, and need to implement designs with minimal effort and risk while...

CMOS to MIPI D-PHY Interface Bridge Soft IP

MIPI D-PHY is a practical PHY for typical camera and display applications. It is designed to replace traditional parallel bus based on LVCMOS or LVDS....

XMOS Technology Whitepaper

Designers for electronic products are challenged by requests for customized and differentiated complex products in short time frames. In this environment...

2:1 MIPI CSI-2 Bridge Soft IP

In some cases, mobile Application Processors (AP) may not have enough interfaces to support the number of image sensor inputs required for a particular...

SOLVING INTELLIGENCE, VISION & CONNECTIVITY CHALLENGES AT THE EDGE WITH ECP5™ FPGAs

This whitepaper will introduce the ECP5™ and LatticeECP3™ FPGAs as viable solutions to overcome embedded design co-processing and connectivity...

Published: Nov 15, 2022

Memory Coalition of Excellence:Recommendations for the National Semiconductor Technology Center

Microelectronic chips, also known as integrated circuits (ICs), are at the heart of our modernday society.Discrete semiconductor memory and storage (DRAM...

Semiconductors / Power-Management ICs

VIBRATION-INDUCED TWO-PHASE COOLING TECHNOLOGIES FOR HIGH POWER THERMAL MANAGEMENT

Engineer’s Guide to 5G Semiconductor Test

Key Considerations for Powertrain HIL Test

Communication Module Requirements for IoT Applications

How to Improve DC/DC Converter Performance with Phase Shifting Time Delay

The Energy Harvesting Tipping Point for Wireless Sensor Applications

Leakage Currents in the Right Perspective

Modular embedded technologies for cognitive RF and EW systems

USING LOW COST, NON-VOLATILE PLDS IN SYSTEM APPLICATIONS

CMOS to MIPI D-PHY Interface Bridge Soft IP

XMOS Technology Whitepaper

2:1 MIPI CSI-2 Bridge Soft IP

SOLVING INTELLIGENCE, VISION & CONNECTIVITY CHALLENGES AT THE EDGE WITH ECP5™ FPGAs

Memory Coalition of Excellence:Recommendations for the National Semiconductor Technology Center

More Semiconductors Topics

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